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Dear friends and colleagues,
It is our privilege and a real honor to welcome you to the 1st International
IEEE Conference on Microwaves, Communications, Antennas and Electronic
Systems (IEEE COMCAS 2008), which will be held in
Tel-Aviv, Israel, May 13th and 14th, 2008. This 2 day international
IEEE Conference will be an expanded, multidisciplinary and complementary
version of our traditional and very successful IEEE Israel AP/MTT & AES
Chapters Symposium.
Last year’s very successful 21st IEEE AP/MTT&AES Chapters
Symposium, which attracted over 500 participants from many companies
and R&D institutions, inspired the organizers to take on the
challenge of organizing an even greater event. The COMCAS
2008 event promises inspiration and enhanced quality, complemented with
a professional exhibition.
The 2008 program will offer a very impressive list of speakers,
including expert R&D engineers, top scientists and managers
from the US, Europe, Far East (Taiwan) and Israel.
Keynote speakers will be Prof. Linda Katehi, Provost, University
of Illinois, USA, and Raviv Melamed, General Manager, Mobile Wireless
Group, Intel Corporation. Greatly enriching the microwave, antenna,
communication, EMC, solid-state circuits (RFIC) and electronic
systems communities with knowledge, ideas, applications and challenges,
the program will include presentations of up-to-date and fascinating
topics. Our ultimate goal is to create a very diverse and multidisciplinary
Conference where engineers and scientists from various complementary
disciplines can meet and discuss subjects of common interest. The
emphasis will be on applications-oriented research and development,
from antennas, devices and components to systems and software.
This combination of technical areas should make for a very robust
and interesting 2-day meeting. The organizers are confident that
you will enjoy it!
New this year! Additional IEEE societies are joining our two days
international Conference. The ComSoc, EMC and SSC are joining the
very popular and well established Microwaves (MTT), Antennas (AP),
and Radars (AES) program. These will provide interests to an audience
of engineers and decision makers from the technology, communication,
radar and electronic systems communities by presenting technology,
circuits, system aspects and innovations in these fields. Papers
will be presented on a variety of subjects, including: RFICs, Low
Power Solid State Circuits, Microwave Plasmonics, Novel Antennas
and Spectrum Data Base Issues, Phased Arrays, Communications Networking,
C3/C4 modeling and simulation, & analysis (MS&A), RF Propagation
to MMW Wavelengths, High Power Amplifiers, Advanced Devices for
Communications, RF Filters, Modeling for EMC, MEMs, Ultra-wide
Band Technology, Vacuum Electronics, Metrology and Parameter Extraction, Space-time
Adaptive Processing, Cognitive Radios/Radar and Spectral Processing.
These are just a few examples of what is planned.
The exhibition will be organized alongside the Conference halls,
with a generous number of companies and agencies presenting CAD
tools, test equipment, RF, MW and MMW components and modules for
electronic systems applications.
We wish to thank the authors and all the people and organizations
that have supported our work.
Special thanks to the Conference’s main sponsors,
Agilent Technologies, Intel Corp., and to the co-sponsors
Herley General Microwave Israel, EYAL Microwave, WIN Semiconductors
Corp (Starlight), MTI, RDT, ORBIT/FR, TE (M/A-COM), STG, Interlligent,
CST and the Microwave Journal (media sponsor) for their
support and generous sponsorship.
As in previous years, this Conference will be a valuable, enriching
and fun event, and an excellent opportunity to meet and socialize
with colleagues.
Shmuel Auster, Conference Chairman
Barry Perlman, Technical Program Committee
(TPC) Chairman
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