Barry Perlman,

Barry S. Perlman is employed by the U.S. Army Communications-Electronics Research, Development and Engineering Center (CERDEC), Fort Monmouth, New Jersey. He has been involved in a number of research and development programs involving advanced electronics for communications, computing, sensing and information technology. He is also the past Computational Technology Area (CTA) Leader for High Performance Computing (HPC) initiatives in Electronics, Networking and Systems and a member of the Computational technology Advisory Panel (CTAAP) where he led a number of programs involving use and application of multiprocessor scalable computing for large scale modeling and simulation.

Dr. Perlman began his career at RCA Laboratories where he was primarily involved with research in area of microwave technology. He had the honor to work side by side with many gifted and talented individuals who provided him with encouragement and guidance. He developed a variety of innovative solid state technologies including studies of transport in III-V semiconductors, parametric devices and amplifiers, and many types of high frequency devices and circuits including extensive work in modeling, simulation and microwave CAD where he is acknowledged as a pioneer. He was promoted to the management position as Group Head for Design Automation. Following RCA, he moved on to join the U.S. Army Research Laboratory where he was responsible for Solid State and High Frequency, MW and MMW Electronics and actively involved in many challenging research and development programs.

Dr. Perlman is a Life Fellow of the IEEE and a member of numerous IEEE Societies including the Microwave Theory and Techniques Society where he serves as an elected member or their Advisory (Executive) Committee and President Elect. He is an advisor to numerous R&D initiatives, e.g. MURI’s and DURINT’s, a member of numerous academic/industrial advisory boards including the NSF IUC Connection One initiative at ASU, the DARPA IMPACT Center on MEMS Modeling at UIUC, Georgia Tech and Leigh, the Engineering Visiting Committee at Purdue, the NJ Nanotechnology Consortium, the NJ R&D Council, the Army Nanotechnology Working Group and Institute for Soldier Nanotechnology at MIT and other IAB’s at Ohio State, UIUC, USF, UHawaii and the Georgia Institute of Technology.

Disclaimer: Dr. Perlman’s association with the IEEE does not represent an endorsement of the IEEE by the U.S. Army CERDEC or the U.S. Army.