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Dear friends and colleagues,
It is our privilege and a real honor to welcome you to the 2nd International IEEE Conference on Microwaves, Communications, Antennas and Electronic Systems (IEEE COMCAS 2009), which will be held in Tel-Aviv, Israel, November 9-11,2009. This 3-day international IEEE Conference will be multidisciplinary and a complementary version of our traditional and very successful IEEE Israel Chapters’ annual Symposium on Microwaves, Communications, Antennas, Solid State Circuits and Electronic Systems.
Last year’s first and very successful international IEEE COMCAS 2008 delivered on the promise of attracting the global community to Israel with more than 700 participants, 146 papers, 15 technical sessions in five parallel meeting rooms, and a relatively large professional exhibition with 62 booths. This was an exciting international conference and exposition that was attended by many top internationally recognized scientists and engineers. The tone of the first COMCAS conference in 2008 also seemed to help promote or encourage increased activity and friendly interchanges among the leading innovators in the field by facilitating networking and personal interactions with peers. Such scientific discussions often help provide insight and new perspectives in addition to building valuable relationships. The result can facilitate more rapid technical progress than that which would be achieved without such interactions. This helps with the advancement and progress of microwave electronics and the associated electronic systems industry.
The 2009 program will offer a very impressive list of speakers, including expert R&D engineers, top scientists and managers from the US, Europe, Far East and Israel. The program will include Keynote presentations of up-to-date and fascinating topics.
Our ultimate goal is to create a very diverse and multidisciplinary conference where engineers and scientists from various complementary disciplines can meet and discuss subjects of common interest. The emphasis will be on applications-oriented research and development, from antennas, devices and components to systems and software. This combination of technical areas should make for a very robust and interesting 3-day meeting. The organizers are confident that you will enjoy it!
New this year! The ED is joining the very popular and well established Microwaves (MTT), Antennas (AP), ComSoc, EMC, SSC and Radars (AES) program. The result will be an expanded program that should be of interest to a wider group of engineers and decision makers from the technology, communication, radar and electronic systems communities by presenting technology, circuits, system aspects and innovations in these fields. Papers will be presented on a variety of subjects including: RFICs, Low Power Solid State Circuits, RF Photonics, Microwave Plasmonics, Novel Antennas and Spectrum Data Base Issues, Phased Arrays, Communications Networking, C3/C4 modeling and simulation,& analysis (MS&A), RF Propagation to MMW Wavelengths, High Power Amplifiers, Advanced Devices for Communications, MW GaAs and GaN technologies, RF Filters, Modeling for EMC, MEMs, Ultra-wide Band Technology, Metrology and Parameter Extraction, Space-time Adaptive Processing, Cognitive Radios/Radar and Spectral Processing. These are just a few examples of what is planned.
The exhibition will be organized alongside the Conference halls, with a generous number of companies and agencies presenting CAD tools, test equipment, RF, MW and MMW components and modules for electronic systems applications.
Special thanks to the Conference's Platinum Patrons, Agilent Technologies, Intel Corp., Herley General Microwave Israel, and to the Gold Patrons, WIN Semiconductors Corp (Starlight), TriQuint Semiconductor, Rockwell Collins, Ansoft, CST, Tech-Cent, Interlligent, M/A COM, MTI, STG, EIM, ORBIT/FR and the Microwave Journal (media supporter) for their generous support.
As in previous years, this Conference will be a valuable, enriching and fun event, and an excellent opportunity to meet and socialize with colleagues.
Shmuel Auster, IEEE COMCAS Chairman
Barry Perlman, IEEE COMCAS TPC Co-Chairman
Roger Pollard, IEEE COMCAS TPC Co-Chairman
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